ISSN 1004-4140
CN 11-3017/P
LU Hao-tian, LU Xiao-qing, ZHANG Xiang-chun, CAI Liang-xu, WU Qiong, ZHANG Hui. Application of X-ray 3D CT Technology on Electrocomponent Failure Analysis[J]. CT Theory and Applications, 2012, 21(3): 433-441.
Citation: LU Hao-tian, LU Xiao-qing, ZHANG Xiang-chun, CAI Liang-xu, WU Qiong, ZHANG Hui. Application of X-ray 3D CT Technology on Electrocomponent Failure Analysis[J]. CT Theory and Applications, 2012, 21(3): 433-441.
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Application of X-ray 3D CT Technology on Electrocomponent Failure Analysis

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    • Abstract
  • Through comparing the functional characteristics of X-ray,traditional CT and SAM,the advantage of X-ray 3D CT technology was analyzed.With the analysis of solder voids,micro switch and different package components,research on the application of 3D CT technology in electronic component failure analysis was conducted.In addition,according to the feature of X-ray 3D CT imaging,the prospect of this technology was discussed.
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