ISSN 1004-4140
CN 11-3017/P
Volume 21 Issue 3
Sep.  2012
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LU Hao-tian, LU Xiao-qing, ZHANG Xiang-chun, CAI Liang-xu, WU Qiong, ZHANG Hui. Application of X-ray 3D CT Technology on Electrocomponent Failure Analysis[J]. CT Theory and Applications, 2012, 21(3): 433-441.
Citation: LU Hao-tian, LU Xiao-qing, ZHANG Xiang-chun, CAI Liang-xu, WU Qiong, ZHANG Hui. Application of X-ray 3D CT Technology on Electrocomponent Failure Analysis[J]. CT Theory and Applications, 2012, 21(3): 433-441.
shu

Application of X-ray 3D CT Technology on Electrocomponent Failure Analysis

  • 1. AVIC Aero-Polytechnology Establishment, Beijing 100028, China;

  • 2. Beijing Samsung Telecom Technology Co., Ltd, Beijing 100028, China;

  • 3. Liaohe oilfield company Jinzhou oil produotion plant, Jinzhou 121209, China

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  • Received Date: March 08, 2012
  • Available Online: December 12, 2022
    Graphical Abstract
    • Abstract
  • Through comparing the functional characteristics of X-ray,traditional CT and SAM,the advantage of X-ray 3D CT technology was analyzed.With the analysis of solder voids,micro switch and different package components,research on the application of 3D CT technology in electronic component failure analysis was conducted.In addition,according to the feature of X-ray 3D CT imaging,the prospect of this technology was discussed.
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