ISSN 1004-4140
CN 11-3017/P
路浩天, 卢晓青, 张祥春, 蔡良续, 吴琼, 张辉. X射线三维CT技术在元器件失效分析中的应用[J]. CT理论与应用研究, 2012, 21(3): 433-441.
引用本文: 路浩天, 卢晓青, 张祥春, 蔡良续, 吴琼, 张辉. X射线三维CT技术在元器件失效分析中的应用[J]. CT理论与应用研究, 2012, 21(3): 433-441.
shu
LU Hao-tian, LU Xiao-qing, ZHANG Xiang-chun, CAI Liang-xu, WU Qiong, ZHANG Hui. Application of X-ray 3D CT Technology on Electrocomponent Failure Analysis[J]. CT Theory and Applications, 2012, 21(3): 433-441.
Citation: LU Hao-tian, LU Xiao-qing, ZHANG Xiang-chun, CAI Liang-xu, WU Qiong, ZHANG Hui. Application of X-ray 3D CT Technology on Electrocomponent Failure Analysis[J]. CT Theory and Applications, 2012, 21(3): 433-441.
shu

X射线三维CT技术在元器件失效分析中的应用

Application of X-ray 3D CT Technology on Electrocomponent Failure Analysis

    摘要
  • 摘要: 通过比较X射线DR,普通断层CT技术,扫描声学显微镜的功能特点,分析了X射线三维CT技术的优势。通过对焊接空洞、微动开关失效案例以及不同封装形式器件的分析,研究了X射线三维CT技术在电子元器件失效分析领域的应用。同时根据X射线三维CT成像的特点,分析了该技术发展的前景。

     

    Abstract: Through comparing the functional characteristics of X-ray,traditional CT and SAM,the advantage of X-ray 3D CT technology was analyzed.With the analysis of solder voids,micro switch and different package components,research on the application of 3D CT technology in electronic component failure analysis was conducted.In addition,according to the feature of X-ray 3D CT imaging,the prospect of this technology was discussed.

     

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